Printed Circuit Board Assembly

• Screen Print - Multiple screen printers with Standard component, micro-component, Ultra-Fine pitch, and BGA component capability

• SMT Placement - Multiple SMT Lines capable of standard, Micro, Ultra-Fine pitch, BGA, and Odd-Form component placement

• SMT Reflow - Multiple solder reflow ovens capable of reflowing Leaded and Lead-Free (ROHS), BGA, Odd-Form, Fine-Pitch, standard, and Micro-Components 

• Double-sided component reflow, utilizing glue attach, or temperature- specific solder

• Wave Solder - Multiple wave solder ovens. Leaded and Lead-Free (ROHS) and Nitrogen atmosphere capability

• Through-Hole Assembly - Automated and manual assembly capabilities include: Radial, Axial, and Odd-Form Components.